When humidity surpasses 80%, electronic devices absorb moisture, resulting in increased weight, expansion and deformation. The corrosion rate of metal components accelerates, while the insulation resistance of dielectric materials diminishes. Potentially leading to insulation breakdown and equipment failure. Furthermore, damp environments promote mould growth and the acids secreted by mould can corrode and damage circuit boards, compromising their functionality.
Common Moisture-Related Issues: mold growth, short circuit faults, performance damage and structural deformation
Moisture Prevention Recommendations
Apply a protective layer on the product surface.
Place calcium chloride desiccant inside the packaging to promptly absorb any excess moisture.
Regularly monitor and control warehouse temperature and humidity to keep relative humidity within specified limits.
Container desiccants are installed in shipping containers to absorb excess moisture and prevent container condensation during transit.
